From Microarchitecture to Silicon: Building High-Performance CPUs across Intel and Qualcomm. International Journal of Computer Science and Engineering Innovations, [S. l.], p. 37–42, 2026. DOI: 10.64137/3107-9458/ICCSEMTI26-107. Disponível em: https://internationaljournalssrp.org/index.php/ijcsei/article/view/217. Acesso em: 3 apr. 2026.